Specialized EMI Shielding Process for Semiconductor Package

Electromagnetic interference (EMI) is an unwanted disturbance caused by external sources that would affect the electrical functionality of the device. This paper presents an advanced approach of electromagnetic interference (EMI) shielding protection for sensitive and critical semiconductor packages. The process employed half-cutting method to apply the EMI coating on the upper-half portion of the device, protecting the Silicon die and internal components from external EMI disturbance. Eventually, the enhanced EMI shielding process would provide advantages of improved quality and eliminate risks of possible assembly issues while providing the main purpose of EMI protection for semiconductor devices. For future studies, the technique could be applied on packages with similar requirement. Prototypes are helpful to validate the effectiveness of the enhanced process.