Package Reliability Performance Study of QFN Device on Different Die Attach Machines

The paper is focused on the reliability performance of quad-flat no-leads (QFN) package evaluated on different die attach machine platforms. Reliability tests were done to check the difference in the quality and reliability performance of the device that undergone die attach process on two different machines. Thermal cycling resulted in significant difference on the two machines, with the device processed in Machine 1 showing reliability failures while on Machine 2 it passed the 1000 thermal cycle. For future works, Machine 2 could be used for devices with critical package reliability requirement.